By MTHULISI SIBANDA
JOHANNESBURG  – HUAWEI has unveiled the Kirin 970 chipset, which has been hailed as a new era in smartphone innovation.
Richard Yu, Huawei Consumer Business Group Chief Executive Officer, unveiled the company’s next-generation chipset for smartphones at the IFA 2017 in Berlin, Germany on Monday.
The executive said the unveiling was part of Huawei’s vision for the future of artificial intelligence (AI).
By combining the power of the cloud with the speed and responsiveness of native AI processing, Huawei is bringing AI experiences to life and changing the way consumers interact with devices, the company stated.
“As we look to the future of smartphones, we’re at the threshold of an exciting new era,” Yu said in his keynote.
He said Huawei was committed to developing smart devices into intelligent devices by building end-to-end capabilities that supported coordinated development of chips, devices and the cloud. The ultimate goal, Yu said, is to provide a significantly better user experience.
“The Kirin 970 is the first in a series of new advances that will bring powerful AI features to our devices and take them beyond the competition.”
Kirin 970 is powered by an 8-core CPU and a new generation 12-core GPU.
Built using a 10nm advanced process, the chipset packs 5.5 million transistors into an area of only one cm².
Huawei’s new flagship Kirin 970 is Huawei’s first mobile AI computing platform featuring a dedicated Neural Processing Unit (NPU). Compared to a quad-core Cortex-A73 CPU cluster, the Kirin 970’s new heterogeneous computing architecture delivers up to 25x the performance with 50x greater efficiency.

– Guardian