The Helio P22 offers the benefits of Artificial Intelligence-accelerated experiences, enhanced photography and reliable, high-speed connectivity to devices.
The chip, according to the company, combines the most power efficient manufacturing processing brought to Android smartphones with MediaTek’s CorePilot technology, allowing for sustainable high performance and power savings.
It brings hardware-driven dual-camera support for 13+8 megapixel setups, supports the latest version of the Bluetooth wireless communication standard and enhances Long Term Evolution (LTE) connectivity.
“With support for high quality dual camera photography, AI enhancements and incredible power efficiency, the Helio P22 sets a new bar for accessibility to premium features,” said TL Lee, General Manager of MediaTek’s Wireless Communication business unit.
MediaTek Helio P22 follows the successful launch of the P60 chipset earlier this year, the first to bring the 12 nanometre (nm) manufacturing process to the mid-range mobile segment.
MediaTek is a Taiwanese semiconductor company providing system-on-chip products for wireless communications.
It enables enables 1,5 billion connected devices a year.
– CAJ News